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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6602 Issued Date : 1993.03.15 Revised Date : 2002.02.20 Page No. : 1/3 HBF4522D NPN TRIPLE DIFFUSION PLANAR TRANSISTOR Description HBF4522D is designed for use in the monitor dynamic focus circuit. It can be used up to 19" monitor with working frequency as high as 100KHz. TO-126ML Features * High Breakdown Voltage * Low C-E Saturation Voltage * High Cutoff Frequency * High Current Gain Absolute Maximum Ratings (Ta=25C) * Maximum Temperatures Storage Temperature ............................................................................................ -50 ~ +150 C Junction Temperature .................................................................................................... +150 C * Maximum Power Dissipation Total Power Dissipation (Ta=25C).................................................................................... 1.5 W Total Power Dissipation (Tc=25C) ..................................................................................... 20 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage..................................................................................... 550 V BVCEO Collector to Emitter Voltage.................................................................................. 550 V BVEBO Emitter to Base Voltage............................................................................................ 5 V IC Collector Current........................................................................................................ 100 mA IB Base Current ................................................................................................................ 20 mA Electrical Characteristics (Ta=25C) Symbol BVCEO BVCBO BVEBO ICBO IEBO *VCE(sat) *hFE fT Min. 550 550 7 100 90 Typ. 0.35 150 Max. 1 100 0.5 200 Unit V V V uA nA V MHz Test Conditions IC=1mA IC=100uA IE=10uA, VCB=500V VEB=5V IC=30mA, IB=3mA VCE=20V, IC=30mA VCE=10V, IE=30mA, ftest=100MHz *Pulse Test: Pulse Width 380us, Duty Cycle2% HBF4522D HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 100000 VCE(sat) @ IC=10IB Spec. No. : HE6602 Issued Date : 1993.03.15 Revised Date : 2002.02.20 Page No. : 2/3 Saturation Voltage & Collector Current Saturation Voltage (mV) 125 C o 75 C o 10000 75 C 1000 125 C 100 o o hFE 100 25 C o 25 C hFE @ VCE=20V 10 1 10 100 10 1 10 100 o Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 1000 25 C o Capacitance & Reverse-Biased Voltage 10 Saturation Voltage (mV) Capacitance (pf) Cob 125 C o 75 C o VBE(sat) @ IC=10IB 100 1 10 100 1 0.1 1 10 100 Collector Current-IC (mA) Reverse Biased Voltage (V) Cutoff Frequency & Collector Current 1000 10 Safe Operating Area PT=1ms PT=100ms Cutoff Frequency (MHz).. . Collector Current-IC (A) 1 PT=1s 0.1 fT @ VCE=10V 0.01 100 1 10 100 0.001 1 10 100 1000 Collector Current-IC (mA) Forward Biased Voltage (V) HBF4522D HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-126ML Dimension Marking: Spec. No. : HE6602 Issued Date : 1993.03.15 Revised Date : 2002.02.20 Page No. : 3/3 A H BF B D E F 3 O H Date Code 4522D Control Code C Style: Pin 1.Emitter 2.Collector 3.Base 2 I G 1 J M L K N 3-Lead TO-126ML Plastic Package HSMC Package Code: D *: Typical DIM A B C D E F G H Inches Min. Max. 0.1356 0.1457 0.0170 0.0272 0.0344 0.0444 0.0501 0.0601 0.1131 0.1231 0.0737 0.0837 0.0294 0.0494 0.0462 0.0562 Millimeters Min. Max. 3.44 3.70 0.43 0.69 0.87 1.12 1.27 1.52 2.87 3.12 1.87 2.12 0.74 1.25 1.17 1.42 DIM I J K L M N O Inches Min. Max. *0.1795 0.0268 0.0331 0.5512 0.5906 0.2903 0.3003 0.1378 0.1478 0.1525 0.1625 0.0740 0.0842 Millimeters Min. Max. *4.56 0.68 0.84 14.00 15.00 7.37 7.62 3.50 3.75 3.87 4.12 1.88 2.14 Notes: 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HBF4522D HSMC Product Specification |
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